M F Rahaman
Dhaka, Feb 17, 2026:
The Bangladesh Semiconductor Industry Association (BSIA) has signed a contract with the Skills for Industry Competitiveness and Innovation Program (SICIP) to train 3,500 skilled professionals for Bangladesh’s semiconductor sector.
The agreement was signed at the SICIP office in Dhaka by Mohammed Walid Hossain, Executive Project Director of SICIP, and M A Jabbar, President of BSIA, on behalf of their respective organizations.
Under the contract, BSIA will provide industry-oriented training to graduates from EEE, ECE, CSE, Applied Physics and related disciplines through six specialized courses. These include IC Design and Layout Engineering; Advanced Physical Design (RTL to GDSII); DFT and Verification Engineering for ASIC Designers; Applied Semiconductor Systems; Smart Systems Engineering; and Packaging and Testing. Each course will run for three months, comprising 240 hours of training.
The total cost of the program is BDT 35.14 crore, and it will be implemented from February 2026 to December 2028. SICIP has set a target of at least 65 percent job placement for certified trainees.
Speaking at the signing ceremony, Mohammed Walid Hossain stressed the need for quality training and strong monitoring to ensure successful outcomes. BSIA President M A Jabbar described the agreement as a milestone for Bangladesh’s semiconductor ecosystem.
SICIP is being implemented under the Finance Division of the Ministry of Finance with support from the Government of Bangladesh and the Asian Development Bank.
Source: BSIA
